Polyimide substrate having a textured surface and...

Details Polyimide substrate having a textured surface and... Polyimide substrate having a textured surface and...

C - Chemistry, Metallurgy

25

D

117/114, 204/18,

C25D 5/56 (2006.01) B05D 3/02 (2006.01) B05D 7/02 (2006.01) C23C 14/20 (2006.01) C23C 18/20 (2006.01) C23C 28/02 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2019155

FN 44229 CAN 9A POLYIMIDE SUBSTRATE HAVING A TEXTURED SURFACE AND METALLIZING SUCH A SUBSTRATE Abstract of the Disclosure The adhesion of metal to a polyimide substrate is enhanced by depositing onto at least one surface of the polyimide a thin film of metal such as copper and heating in air to cause the deposited metal to texturize that surface by producing asperities that are at least 0.05 µm in average height and average breadth. In doing so, metal oxide clusters are formed at the textured surface. When the textured surface is metallized, the resulting composite resists delamination even at soldering temperatures.

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