B - Operations – Transporting – 41 – J
Patent
B - Operations, Transporting
41
J
B41J 2/015 (2006.01)
Patent
CA 2572096
A polyimide photoresist for thick film flow features adheres to a polyimide nozzle plate or other materials, without the use of an adhesive material between the two surfaces. Further, the photoresist can utilize an acrylate UV initiator, which can reduce the potential for HF to interact with the ink, and which can cause flocculation and eliminate the need for extremely long postbake cures used to remove HF from the photoresist. In another embodiment, an epoxy adhesive containing a dicyandiamide catalyst can be used to improve adhesion between polyimide films and a respective substrate.
Photorésine polyimide aux caractéristiques d'écoulement de film épais adhérant à une plaque d'éjection polyimide ou autres matériaux, sans emploi d'une substance adhésive entre les deux surfaces. Avec cette photorésine, il est par ailleurs possible d'utiliser un initiateur acrylate d'UV, ce qui réduit les risques d'interaction de l'acide fluorhydrique avec l'encre et de floculation, et évite les temps de durcissement post-étuvage extrêmement longs nécessaires pour éliminer l'acide fluorhydrique de la photorésine. Dans un autre mode de réalisation, on utilise un adhésif époxy contenant un catalyseur dicyandiamide afin d'améliorer l'adhésion entre des films polyimides et leurs substrats.
Bertelsen Craig M.
Weaver Sean T.
Lexmark International Inc.
Smart & Biggar
LandOfFree
Polyimide thickfilm flow feature photoresist and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polyimide thickfilm flow feature photoresist and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide thickfilm flow feature photoresist and method of... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1744736