Polyimides end-capped with diaryl substituted acetylene

C - Chemistry – Metallurgy – 08 – G

Patent

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356/133, 356/162

C08G 73/10 (2006.01) C08J 5/24 (2006.01) C09J 179/08 (2006.01) H01L 21/31 (2006.01) H01L 21/441 (2006.01) H01L 23/29 (2006.01)

Patent

CA 2035816

Novel polyimide and polyisoimide oligomers and precursors thereof are end-cappedwith diaryl substituted acetylene. The resultant polymerizable oligomers have high cure temperatures, good viscosity and toughness (via longer oligomers), while maintaining their processibility and suitability for intended use. These novel end-capped polyimide or polyisoimide oligomers are useful for composites, molding compounds, adhesives, and electronic applications.

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