Polyisocyanate adhesives and wood composites therefrom

Details Polyisocyanate adhesives and wood composites therefrom Polyisocyanate adhesives and wood composites therefrom

C - Chemistry, Metallurgy

08

G

18/1010, 400/111

C08G 18/10 (2006.01) C08G 18/64 (2006.01) C08L 75/04 (2006.01) C08L 97/02 (2006.01) C09J 175/00 (2006.01)

Patent

CA 1176778

ABSTRACT OF THE DISCLOSURE A heat-curable adhesive is described comprising a liquid poly- isocyanate, a hydrocarbon oil and a salt of u higher fatty acid The adhesive is fast-curing and has mold release properties. Hot-pressed wood composites have been prepared (e.g. waferboard) with relatively short hot-pressing times and without sticking.

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