C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/1124, 400/49
C08L 9/00 (2006.01) C08L 7/00 (2006.01) C08L 21/00 (2006.01) C08L 23/16 (2006.01)
Patent
CA 1187229
Abstract of the Disclosure A rubber composition having improved cut growth resistance, processability and dimensional stability is disclosed, which comprises not less than 20 parts by weight of polyisoprene having a melting point of not less than 10°C and a content of cis-1,4 bond of not less than 88% and the balance of at least one diene rubber.
408747
Hirata Yasushi
Ogawa Masaki
Sakakibara Mitsuhiko
Tagata Nobuo
Takeuchi Yasumasa
Bridgestone Tire Company Limited
Japan Synthetic Rubber Co. Ltd.
Swabey Ogilvy Renault
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