Polymaleimide compound and silicone resin containing phenyl...

Details Polymaleimide compound and silicone resin containing phenyl... Polymaleimide compound and silicone resin containing phenyl...

C - Chemistry, Metallurgy

08

L

400/4110, 400/53

C08L 61/14 (2006.01) C08G 77/455 (2006.01) C08L 79/08 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1334554

A thermosetting resin composition is prepared by mixing (A) a phenol novolak resin having hydroxy groups and allyl-etherified hydroxy groups, (B) a polymaleimide compound having two or more maleimide groups in the molecule, and (C) at least one silicone resin having the following formula (I); Image (I) wherein R1 and R2, which may be the same or different, are methyl or phenyl; R3 and R4, which may be the same or dif- ferent, are methyl, phenyl, hydrogen or a group having an amino group or an epoxy group but at least one of R3 and R4 is hydrogen or a group having an amino group or an epoxy group; and ? and m, which may be the same or different, are a number of 0-400. The thermosetting resin composition of the present invention can be suitably used for encapsulating electric devices, for example, and gives, by curing, a cured resin product of high quality.

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