C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 8/14 (2006.01) C08F 2/48 (2006.01) C08F 12/08 (2006.01) C08F 20/10 (2006.01) C08F 290/04 (2006.01) C08L 25/06 (2006.01) C08L 33/06 (2006.01) C08L 51/06 (2006.01) C09D 151/06 (2006.01) C09J 151/06 (2006.01)
Patent
CA 2321784
A vinyl polymer having per molecule at least one group represented by general formula (1): -OC(O)C(R)=CH2 at a molecular end; a curable composition containing the polymer; an aqueous emulsion containing the polymer or the curable composition; and a pressure-sensitive adhesive composition and a pressure-sensitive adhesive each comprising the curable composition or the aqueous emulsion. (In the formula, R represents hydrogen or a C1-20 organic group.)
Cette invention concerne un polymère de vinyle qui comprend pour chaque molécule, et au niveau d'une extrémité moléculaire, au moins un groupe correspondant à la formule générale (1) -OC(O)C(R)=CH¿2? où R représente hydrogène ou un groupe organique C¿1-20?. Cette invention concerne également une composition solidifiable qui contient ce polymère, une émulsion aqueuse qui contient le polymère ou cette composition solidifiable, ainsi qu'une composition d'adhésif autocollant et un adhésif autocollant qui contiennent chacun la composition solidifiable ou l'émulsion aqueuse.
Fujita Masayuki
Kitano Kenichi
Nakagawa Yoshiki
Kaneka Corporation
Riches Mckenzie & Herbert Llp
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