Polymer composition

C - Chemistry – Metallurgy – 08 – L

Patent

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C08L 77/00 (2006.01) C08K 5/00 (2006.01) C08K 5/25 (2006.01) C08L 23/00 (2006.01) C08L 23/02 (2006.01) C08L 23/26 (2006.01) C08L 51/06 (2006.01)

Patent

CA 2009727

ABSTRACT OF THE DISCLOSURE A polymer composition comprising resin components comprising (a) 5-95 weight % of a polyamide resin, and (b) 5-95 weight % of polyolefin + unsaturated carboxylic acid-modified polyolefin, and (c) additives comprising the following compounds in amounts per 100 parts by weight of the total composition: (1) 0.1-2 parts by weight of a substituted hydrazine; (2) 0.05-2 parts by weight of a hindered phenol compound; (3) 0.05-0.5 parts by weight of a phosphite or phosphonite; and (4) 0.15-1 parts by weight of a thiodipropionate.

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