C - Chemistry – Metallurgy – 04 – B
Patent
C - Chemistry, Metallurgy
04
B
400/7923
C04B 26/14 (2006.01) C08L 63/00 (2006.01) C08L 63/04 (2006.01) C08K 3/00 (2006.01)
Patent
CA 2268859
A structure comprising a filled thermosetting polymer composition. The filled thermosetting polymer composition has a mineral filler content of at least 92% by weight and not more than 8% by weight of thermosetting polymer, and a co-efficient of thermal expansion that is less than 15 x 10-6 in/in/°F. The filler is a mineral particulate filler with generally rounded edges and the thermosetting polymer composition having a density that is at least 95% of the theoretically density for said filler and polymer. The filler is comprised of at least 50% by weight of a particle size that is greater than 6 mm, at least 70% by weight of a particle size that is greater than 2.4 mm, and at least 90% by weight of a particle size that is greater than 0.4 mm, with the thermosetting polymer being obtained by reaction of (a) an epoxy resin formed from at least one of Bisphenol A and Bisphenol F with (b) an amine selected from at least one of an aliphatic and a cyclo-aliphatic amine. Embodiments of the composition per se may be used to form a structure for resisting acid solutions.
Cappar Limited
Sim & Mcburney
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