C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 10/02 (2006.01) C08F 110/02 (2006.01) C08F 220/02 (2006.01) C08L 23/04 (2006.01) C08L 23/06 (2006.01)
Patent
CA 2570136
Resins comprising a relatively high-density, low-molecular-weight polyethylene component and a relatively low-density, high-molecular-weight ethylene copolymer component and methods of making the resins are disclosed. The rheological polydispersity of the high-density component exceeds that of either the resin or the low-density component. The resins are valuable for making films, sheets, coatings, pipes, fibers, and molded articles having a favorable balance of good stiffness and excellent environmental stress crack resistance.
Résines avec densité relativement élevée, composant polyéthylène de faible poids moléculaire et de densité relativement faible, composant copolymère éthylène de poids moléculaire élevé et méthodes de fabrication de ces résines.La polydispersité rhéologique du composant haute densité excède celle de la résine ou du composant faible densité.Les résines sont intéressantes pour fabriquer des films, des feuilles, des revêtements, des tuyaux, des fibres et des articles moulés ayant un équilibre favorable entre une bonne raideur et une excellente résistance aux fissures de contraintes environnementales.
Garrison Philip J.
Lynch Michael W.
Mack Mark P.
Mavridis Harilaos
Mehta Sameer D.
Equistar Chemicals Lp
Osler Hoskin & Harcourt Llp
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