Polymer useful for molding into a circuit board substrate

Details Polymer useful for molding into a circuit board substrate Polymer useful for molding into a circuit board substrate

C - Chemistry, Metallurgy

08

G

402/320

C08G 65/40 (2006.01) C08G 75/23 (2006.01) H01B 3/30 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1255433

A POLYMER USEFUL FOR MOLDING INTO A CIRCUIT BOARD SUBSTRATE ABSTRACT OF THE DISCLOSURE Described are select polyarylethersulfones polymers which are useful for molding into a circuit board substrate. When metal is electroplated onto such a substrate, there is a high degree of adhesion of the metal to the circuit board. S P E C I F I C A T I O N D-14243

470149

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