Polymeric amide-ester resin heat-resistant...

Details Polymeric amide-ester resin heat-resistant... Polymeric amide-ester resin heat-resistant...

H - Electricity

01

L

96/219, 400/5139

H01L 21/312 (2006.01) C08F 290/14 (2006.01) G03F 7/037 (2006.01)

Patent

CA 1165932

ABSTRACT OF THE DISCLOSURE A polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups useful for forming relief structures on electrical devices such as capacitors, integrated circuits and semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer which forms an electrical device, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is baked to form a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition: a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.

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