Polymeric amides

Details Polymeric amides Polymeric amides

C - Chemistry, Metallurgy

08

G

402/234, 400/780

C08G 73/14 (2006.01) C08G 69/40 (2006.01) C08L 79/08 (2006.01)

Patent

CA 1327253

POLYMERIC AMIDES ABSTRACT OF THE DISCLOSURE Thermoplastic polymeric amides are disclosed which have utility as hot melt adhesive compounds. The compounds are the reaction product of a polyoxyalkylene diimide diacid and a diamine.

599438

Affiliated with

Also associated with

Rating

Polymeric amides does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polymeric amides, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polymeric amides will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1256106