Polymeric stencil for use in electronic assemblies and...

H - Electricity – 05 – K

Patent

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Details

H05K 3/12 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2181207

A method of manufacturing a polymeric stencil, and in particular a polyimide stencil, for use in solder paste printing of electronic circuit boards involves assembling the polymeric stencil to a frame structure of metallic material such as aluminum. The polymeric stencil is secured tautly across the frame structure. The polymeric stencil typically has a thickness in the range of 0.005 to 0.012 inches and lends itself to being readily cut by low power lasers. The preferred method of cutting land patterns from the stencil utilizes a CO2 laser. The process lends itself to pre-fabrication of the frame and stencil prior to cutting to reduce the turn around time to produce a stencil once an order is taken. The polymeric stencil can be readily cleaned with a mild detergent after laser cutting.

Méthode pour obtenir un stencil polymérique, notamment un stencil de polyimide, utile dans l'impression de plaquettes de circuits électroniques à l'aide de soudure en pâte; elle consiste à monter le stencil polymérique sur un cadre métallique, p. ex. d'aluminium. Le stencil tendu est fixé sur le cadre. Il a généralement une épaisseur de 0,005 à 0,012 po et peut être facilement coupé par des lasers de faible puissance. Pour couper des modèles de circuit, on privilégie l'emploi de lasers au CO2. Le procédé permet de préfabriquer le cadre et le stencil avant la coupe, ce qui réduit le délai d'exécution pour la fabrication d'un stencil, une fois reçue la commande. Le stencil polymérique peut être facilement nettoyé à l'aide d'un léger détergent après la coupe au laser.

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