Polymeric void-board

Details Polymeric void-board Polymeric void-board

B - Operations, Transporting

65

B

B65B 27/02 (2006.01) B65B 35/50 (2006.01) B65B 61/20 (2006.01) B65D 71/00 (2006.01) B65D 85/46 (2006.01)

Patent

CA 2492233

An extruded polymeric void-board is configured for placement between adjacent horizontal layers of bricks to maintain an opening in a lower layer of the bricks. The void-board is formed as a relatively thin planar element having first and second surfaces. A plurality of parallel ribs extend from and generally transverse to the first side. The ribs have a predetermined height to width ratio and have a height that is less than a thickness of the planar element. The ribs being formed parallel to one another. A method for forming a bundle of bricks with the void-board is also disclosed.

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