Polymerisable compositions

Details Polymerisable compositions Polymerisable compositions

C - Chemistry, Metallurgy

08

L

C08L 33/04 (2006.01) C08C 19/25 (2006.01) C08C 19/36 (2006.01) C08F 8/42 (2006.01) C08F 287/00 (2006.01) C08F 291/00 (2006.01) C08F 292/00 (2006.01) C08K 3/00 (2006.01) C08K 3/36 (2006.01) C08L 53/00 (2006.01) C08L 57/00 (2006.01)

Patent

CA 2121468

2121468 9310183 PCTABS00022 Highly filled, curable compositions containing a curable liquid, e.g. methyl methacrylate; 20 to 80 % by weight of a finely divided inorganic filler of defined particle size, e.g. silica; a non-functionalised polymer containing a low Tg component which is soluble in the curable liquid, e.g. a non-functionalised vinyl aromatic/conjugated diene block copolymer; and other components which disperse the filler in the curable liquid and couple the filler to the matrix can be used to produce cured composites which show improved resistance to stress induced by thermal cycling.

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