C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
117/183, 402/216
C08L 79/08 (2006.01) B32B 27/04 (2006.01) C08G 73/12 (2006.01) C08J 5/24 (2006.01) H05K 1/03 (2006.01)
Patent
CA 1254342
ABSTRACT Superior polyimide prepolymers particularly suitable for fabrication of multi-layer printed boards are produced by reacting unsaturated bisimides with diamines to consist essentially of 41 - 55% of unreacted reactants, 39 - 54% of components having a molecular weight of between 400 and 15000, and 3.0 - 6.8% of components having a molecular weight of more than 15000. The resulting prepolymers enable the preparation of their solution having enough working life for successfully impregnating a given substrate therewith in the preparation of prepregs. The prepregs, prepared from the above prepolymers in such a way as to contain within the resin content thereof 29 - 35% of of unreacted reactants, 51 - 65% of the components having a molecular weight of between 400 and 15000, and 5 - 14% of the components having a molecular weight of more than 15000, allow the fabrication of laminate products with remarkable dimension stability under a low molding pressure to eliminate the presence of voids in the products, in addition to that the prepregs ensure a high bond strength as well as elongated working life which is responsible for prevention of a blister in the finished laminate and for easy control of the laminate forming process.
497050
Matsumura Masahiro
Nakamoto Atsuhiro
Ogasawara Kenzi
Sugawa Yashihisa
Matsushita Electric Works Ltd.
Mcfadden Fincham
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