Polynorbornene laminates

B - Operations – Transporting – 32 – B

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B32B 15/14 (2006.01) B32B 15/08 (2006.01) B32B 15/20 (2006.01) B32B 17/04 (2006.01) B32B 27/04 (2006.01) C08G 61/08 (2006.01) C08J 5/08 (2006.01) C08J 5/24 (2006.01) H05K 1/03 (2006.01) H05K 1/05 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1293434

TITLE OF THE INVENTION: POLYNORBORNENE LAMINATES ABSTRACT OF THE DISCLOSURE Printed wiring boards useful for high frequency applications are obtained by laminating a copper foil pretreated with a silane to a polynorbornene prepreg. The prepreq is made by impregnating a fiberglass cloth with a ring-opening polymerized polymer. The copper foil is pretreated with a silane which is capable of improving the bond strength between the copper foil and a norbornene copolymer.

607473

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