C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 23/00 (2006.01) B29C 47/00 (2006.01) B60J 10/00 (2006.01) C08J 3/20 (2006.01) C08J 5/00 (2006.01) C08J 5/14 (2006.01) C08K 3/00 (2006.01) C08K 9/04 (2006.01)
Patent
CA 2353065
A polyolefin resin composition which has satisfactory moldability and gives a molding having an excellent balance between rigidity and impact resistance. The composition comprises a mixture of a polyolefin resin and an inorganic filler having an average particle diameter of 10 µm or smaller, wherein the content of the inorganic filler is 0.5 to 85 wt.% based on the mixture.
Une composition de résine de polyoléfine présentant une bonne aptitude au moulage permet d'obtenir un moulage ayant un très bon équilibre entre rigidité et résistance aux chocs. Cette composition renferme un mélange de résine de polyoléfine et de charge inorganique présentant un diamètre moyen de particules égal ou inférieur à 10µm, la teneur de la charge inorganique étant comprise entre 0,5 et 85 % en poids, sur la base du mélange.
Higashikawa Kiyoshi
Ishii Masahiro
Omura Hirofumi
G. Ronald Bell & Associates
Sekisui Chemical Co. Ltd.
Tokuyama Sekisui Co. Ltd.
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