C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 59/00 (2006.01) C08K 3/22 (2006.01) C08K 3/26 (2006.01) C08K 5/00 (2006.01) C08K 13/02 (2006.01) C08L 61/28 (2006.01)
Patent
CA 2130716
Abstract: To provide a polyoxymethylene composition which is improved in heat stability, particularly reduced in the amount of deposit formed on molds during molding, and which is useful for the production of the part of electrical or electronic equipment to give electrical or electronic equipment which little suffers from malfunction due to the formic acid generated from the composition (the malfunction including staining with the substance bleeding from a part made from a rubber and corrosion of a magnetic metal member). The title composition can be prepared by blending 100 parts by weight of a polyoxymethylene with (a) 0.01 to 5.0 parts by weight of an antioxidant, (b) 0.01 to 5.0 parts by weight of a melamine-formaldehyde polycondensate and (c) 0.001 to 10 parts by weight of at least one metallic compound selected from among oxides and carbonates of magnesium and calcium.
Iizuka Hiroko
Sugiyama Noriyuki
Polyplastics Co. Ltd.
Smart & Biggar
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