Polyphenylene ether resin composition

C - Chemistry – Metallurgy – 08 – K

Patent

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400/3001, 400/63

C08K 5/53 (2006.01) C08K 5/5333 (2006.01) C08K 5/5353 (2006.01) C08L 51/08 (2006.01) C08L 53/02 (2006.01)

Patent

CA 1175977

ABSTRACT A polyphenylene ether resin composition having improved heat stability, said composition comprising a polyphenylene other resin matrix, and dispersed therein, a phosphonic acid or its derivative of the formula Image (I) wherein R1 represents an unsubstituted or substituted phenyl or naphthyl group, or a linear or branched alkyl group with 1 to 18 carbon atoms, or a group of the following formula (a) Image R2 and R3 are identical or different and each represents hydrogen atom, a metal, an unsubstituted or substituted phenyl group, or an alkyl group with 1 to 10 carbon atoms; and R4 is a divalent hydrocarbon group with 2 to 10 carbon atoms.

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