Polyphenylene ether resin composition having improved heat...

C - Chemistry – Metallurgy – 08 – K

Patent

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400/3026, 400/83

C08K 5/53 (2006.01) C08K 5/5393 (2006.01) C08L 53/02 (2006.01)

Patent

CA 1156788

ABSTRACT OF THE DISCLOSURE The invention relates to a polyphenylene ether resin composition having improved heat stability. The composition comprises a polyphenylene ether resin matrix, and dispersed therein, a diphosphonite of the formula Image wherein R1 groups are identical or different and each represents a linear or branched alkyl group having 1 to 10 carbon atoms.

372540

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