Polyphenylene ether resin composition suitable for...

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C - Chemistry, Metallurgy

08

L

400/3033, 117/77

C08L 53/02 (2006.01) C08L 25/00 (2006.01) C08L 25/10 (2006.01) C08L 71/12 (2006.01)

Patent

CA 1236611

POLYPHENYLENE ETHER RESIN COMPOSITION SUITABLE FOR ELECTROLESS PLATING ABSTRACT A polyphenylene ether resin composition comprising: (a) a polyphenylene ether resin (b) a polystyrene type resin (c) an A-B-A? type elastomeric block copolymer wherein A and A? represent blocks resulting from polymerization of an aromatic vinyl compound, and B represents a block resulting from polymerization of a conjugated diene compound, and (d) an elastomeric styrene/butadiene random copolymer, which is suitable for electroless plating. Molded articles formed by using the resin composition of this invention can be plated using conventional electroless plating processes for ABS resins.

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