C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
154/126, 117/198
C08L 63/02 (2006.01) C08L 71/12 (2006.01) H05K 1/03 (2006.01)
Patent
CA 2026956
60LT01059 POLYPHENYLENE OXIDE/HYBRID EPOXY RESIN SYSTEM FOR ELECTRICAL LAMINATES ABSTRACT OF THE DISCLOSURE Disclosed are curable compositions based on a combination of polyphenylene ether, an upstaged epoxy resin combination, a multifunctional epoxy resin, and suitable curing agents. The upstaged epoxy resin combination comprises a low molecular weight brominated upstaged epoxy resin and a monomeric brominated epoxy resin. The composition may be used in the preparation of laminates useful as printed circuit boards.
Chu Edward F.
Kubisen Steven J.
Tiburcio Astrophel C.
Tracy James E.
Chu Edward F.
Craig Wilson And Company
Kubisen Steven J.
Tiburcio Astrophel C.
Tracy James E.
LandOfFree
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