Polyphthalamide resin formulations

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 77/06 (2006.01) C08K 3/16 (2006.01) C08L 23/06 (2006.01) C08L 23/12 (2006.01) C08L 23/16 (2006.01) C08L 53/02 (2006.01)

Patent

CA 2170228

Polylphthalamide formulations containing from 0.1 to about 2 wt% alkali metal halide have a significantly reduced melt viscosity and both filled and unfilled resin formulations containing the requisite amount of alkali metal halide are more readily processed by thermal means. When stabilized with a copper-containing stabilizer and, optionally, a polyolefin synergist the formulations exhibit substantially improved dry heat stability and are particularly useful in the production of thermally-stabilized melt spun polyphthalamide fiber for applications where extended exposure to elevated temperatures in air is contemplated.

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