C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3079
C08L 53/00 (2006.01) C08K 3/00 (2006.01) C08K 5/14 (2006.01) C08L 23/16 (2006.01)
Patent
CA 1262387
- 27 - Abstract Disclosed herein is a polypropylene-base resin composition obtained by heating at a temperature of 170°C - 280°C a mixture containing a crystalline ethylene-propylene block copolymer having a specific composition, an ethylene-propylene copolymer rubber having a specific composition and viscosity, an inorganic filler having a specific particle size, and an organic peroxide, all in specified amounts. The thus-obtained polypropylene-base resin composition has high molding fluidity and are inexpensive and their moldings have excellent low-temperature impact resistance and paintability along with high stiffness. They are thus suitable for use in the production of large moldings such as automobile bumpers, fenders and body sidemembers.
505924
Abe Masaru
Hayashi Shigeru
Kawai Yoichi
Sekiguchi Katsumi
Yoshihara Akio
Mitsui Toatsu Chemicals Inc.
Sim & Mcburney
LandOfFree
Polypropylene-base resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polypropylene-base resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polypropylene-base resin composition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1313736