C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3029, 400/30
C08L 51/06 (2006.01) B32B 27/32 (2006.01) C08F 287/00 (2006.01) C08L 53/00 (2006.01) C09J 123/10 (2006.01) C09J 151/06 (2006.01)
Patent
CA 2003978
1 9 ABSTRACT OF THE DISCLOSURE The present invention relates to a polypropylene composition useful as an adhesive comprising a modified polypropylene resin graft-modified with from about 0.01 wt. % to about 2 wt. % of a radical-polymerizable unsaturated compound and a crystalline propylene/ethylene block copolymer containing from about 10 wt. % to about 50 wt. % of a propylene/ethylene random copolymer having an ethylene content of from about 20 wt. % to about 90 wt. %. The resin composition is particularly suitable for bonding a polypropylene resin layer and an ethylene/vinyl alcohol copolymer layer, and a polypropylene resin layer and a polyamide resin layer.
Kawai Yoichi
Miyazaki Takashi
Nitta Katsuyuki
Suehiro Keigo
Yokote Sachio
Kirby Eades Gale Baker
Mitsui Toatsu Chemicals Inc.
LandOfFree
Polypropylene composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polypropylene composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polypropylene composition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1544950