Polypropylene composition

C - Chemistry – Metallurgy – 08 – L

Patent

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400/3035, 400/30

C08L 51/06 (2006.01) C08L 23/10 (2006.01) C08L 23/12 (2006.01) C08L 23/16 (2006.01) C08L 63/00 (2006.01) C08L 67/00 (2006.01) C08L 67/02 (2006.01)

Patent

CA 1329961

ABSTRACT OF THE DISCLOSURE The polypropylene composition of the present invention comprises: a blend of a resin composition composed of a specific polypropylene type resin (C) and at least one saturated polyester resin (D), an epoxy group containing copolymer (e) and at least one rubber selected from the group consisting of an ethylenic copolymer rubber (F), a modified ethylenic copolymer rubber (G) obtained by graft copolymerizing an unsaturated carboxylic acid or a derivative thereof onto an ethylenic copolymer rubber and a modified ethylenic copolymer rubber (H) obtained by graft copolymerizing an unsaturated carboxylic acid or derivative thereof and an unsaturated aromatic monomer onto an ethylenic copolymer rubber, and a basic compound (I) optionally added as a reaction accelerator. The polypropylene composition according to the present invention is not only good in molding proces- sability but also markedly effective in that it can give molded products much superior in physical properties to those obtained from individual polymers constituting the thermoplastic resin composition. The novel polypropylene composition provided by the present nvention can easily be processed into a molded product, a film, a sheet or the like by a molding method usually used for molding thermoplastic resins, for example, injection molding, extrusion molding or the like, giving a product which has a very good balance among stiffness, heat resistance, impact resistance, scratch resistance, coating properties, oil resistance, chemical resistance, water resistance, etc., and is ecellent in appearance uniforming and smoothness. It can be advantageously used for a purpose requiring especially high heat resistance and impact resistance, in particular, low-temeprature impact resistance.

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