C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
154/106, 400/307
C08L 51/06 (2006.01) B32B 27/08 (2006.01) C08J 5/12 (2006.01) C08J 11/06 (2006.01) C09J 123/10 (2006.01) C09J 151/06 (2006.01)
Patent
CA 2003390
1 6 ABSTRACT OF THE DISCLOSURE The present invention relates to a polypropylene resin composition useful as an adhesive comprising (A) from about 55 wt. % to about 99 wt. % of a modified polypropylene resin graft-modified with a radical polymerizable polar unsaturated compound or a mixture of the same with an unmodified polypropylene resin, and (B) from about 1 to about 45 wt. % of an ethylene/propylene copolymer rubber having an ethylene content of from about 10 wt. % to about 45 wt. %.t. The resin composition is particularly suitable for bonding a polypropylene resin layer and an ethylene/vinyl alcohol copolymer layer and for bonding a polypropylene resin layer and a polyamide resin layer.
Abe Masaru
Kawai Yoichi
Miyazaki Takashi
Abe Masaru
Kawai Yoichi
Kirby Eades Gale Baker
Mitsui Toatsu Chemicals Inc.
Miyazaki Takashi
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