Polypropylene resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 53/00 (2006.01) C08L 23/08 (2006.01)

Patent

CA 2134176

ABSTRACT OF THE DISCLOSURE A polypropylene resin composition, which exhibits an excellent coating adherence, high rigidity, high impact strength at low temperatures, prominent heat resistance and excellent appearance of moldings even without effecting a treatment with trichloroethane as a pretreatment step before coating, comprises 30 to 92 % by weight crystalline ethylene propylene block copolymer(A), 5 to 30 % by weight ethylene- .alpha. olefin copolymer rubber (B), 3 to 20 % by weight ethylene-butene-1 copolymer (C) having the following characteristics: (C1) a density of 0.870 to 0.915 g/cm3, (C2) a melt index at 190 °C of 5 to 30 g/10minutes, and (C3) a melt peak at 100 °C or higher as determined in the thermogram with increasing temperature by a Differential Scanning Calorimeter (DSC), and 0 to 20 % by weight inorganic filler (D).

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