C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3080, 400/64
C08L 9/00 (2006.01) B05D 3/06 (2006.01) B05D 7/02 (2006.01) B29C 59/14 (2006.01) C08J 3/28 (2006.01) C08J 7/04 (2006.01) C08L 23/10 (2006.01) C08L 23/16 (2006.01) C08L 47/00 (2006.01) C08L 53/00 (2006.01)
Patent
CA 2038307
Herein provided are a polypropylene resin composition which comprises (A) a polypropylene, (B) an ethylene-propylene-diene terpolymeric rubber having a Mooney viscosity, ML1+ ~ (100°C ), ranging from 5 to 50 and an iodine value of not less than 15, the content of the component (B) ranging from 10 to 50% by weight on the basis of the total weight of the components (A) and (B), and optionally (C) an inorganic filler in an amount ranging from 0 to 44 parts by weight per 100 parts by weight of the sum of the components (A) and (B); a coating method which comprises the steps of applying a primer coating to a molded product obtained by molding the foregoing polypropylene resin composition or irradiating the molded product with plasma without degreasing and washing the product with a halogen atom-containing organic solvent and then applying a top coat to the product; and a coating method which comprises the steps of degreasing and washing a molded product obtained by molding the foregoing polypropylene resin composition and then applying a top coat to the product without applying a primer coating to the molded product or irradiating the molded product with plasma. The coated film obtained according to the foregoing methods has good bond strength to the molded product.
Inokuma Takeaki
Kamiya Yoshiyasu
Kawai Yoichi
Nitta Katsuyuki
Sekiguchi Katsumi
Kirby Eades Gale Baker
Mitsui Chemicals Incorporated
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