Polypropylene resin composition having high dielectric strength

Details Polypropylene resin composition having high dielectric strength Polypropylene resin composition having high dielectric strength

C - Chemistry, Metallurgy

08

L

400/3069

C08L 53/00 (2006.01) C08K 3/34 (2006.01)

Patent

CA 2000194

18 ABSTRACT OF THE DISCLOSURE The present invention relates to a polypropylene resin composition having high dielectric strength comprising: A) from about 50% to about 80% by weight of a crystalline ethylene-propylene block copolymer having a melt flow index (MI) at 230°C of not less than about 3 g/10min and an ethylene content of not less than about 4% by weight; B) from about 15% to about 30% by weight of mica having an average particle size of from about 15 to about 50 microns and the following particle size distribution: ? 30 microns from about 10% to about 80% by weight ? 20 microns from about 30% to about 95% by weight ? 10 microns not less than about 60% by weight ? 5 microns not less than about 80% by weight C) from about 5% to about 20% by weight of talc having an average particle size of from about 15 to about 40 microns and the following particle size distribution: ? 30 microns from about 20% to about 65% by weight ? 20 microns from about 40% to about 80% by weight ? 10 microns from about 65% to about 95% by weight ? 5 microns not less than about 85% by weight.

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