C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/6574, 400/94
C08K 5/00 (2006.01) C08L 23/00 (2006.01) C08L 23/12 (2006.01)
Patent
CA 1199140
ABSTRACT OF THE DISCLOSURE A film for aluminum deposition which is produced from a resin composition comprising a blend of 100 parts by weight of polypropylene resin with (i) 0.01 to 0.2 part by weight of an antioxidant having a melting point of 80C or higher and (ii) 0 to 0.5 part by weight of an antiblocking agent, and which contains 5 wt% or less of cold xylene soluble matters. The film of the invention is greatly improved in adhesion to aluminum.
432112
Hao Hideyuki
Kawakita Toshio
Kuroda Kazuhisa
Riches Mckenzie & Herbert Llp
Sumitomo Chemical Co. Ltd.
LandOfFree
Polypropylene resin film for aluminum deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polypropylene resin film for aluminum deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polypropylene resin film for aluminum deposition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1190761