Polypropylene resin for high-rigidity molded products

Details Polypropylene resin for high-rigidity molded products Polypropylene resin for high-rigidity molded products

C - Chemistry, Metallurgy

08

F

402/624

C08F 10/00 (2006.01) C08F 12/06 (2006.01) C08F 12/34 (2006.01) C08F 32/00 (2006.01) C08F 36/00 (2006.01) C08F 38/00 (2006.01) C08F 110/00 (2006.01) C08F 110/06 (2006.01) C08F 112/06 (2006.01) C08F 112/34 (2006.01) C08F 132/00 (2006.01) C08F 136/00 (2006.01) C08F 138/00 (2006.01) C08F 210/00 (2006.01) C08F 212/06 (2006.01) C08F 212/34 (2006.01) C08F 232/00 (2006.01) C08F 236/00 (2006.01) C08F 238/00 (2006.01)

Patent

CA 1193396

ABSTRACT OF THE DISCLOSURE A polypropylene resin from which high-rigidity molded products can be produced even when no particular additive is added, is provided, which resin has a melt rate of 0.1 to 100, a density or 0.905 to 0.936, and a boiling n-heptane-insoluble part whose isotactic pentad ratio (Po) is 0.975 to 0.995, and whose pentad ratio (P2) having two different kinds of configurations of 0.002 to 0.000%, and preferably has a melting point of 165° to 170°C as measured by differential scanning calorimetry.

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