B - Operations – Transporting – 32 – B
Patent
B - Operations, Transporting
32
B
18/1018, 154/103
B32B 27/06 (2006.01) B32B 37/22 (2006.01) H05K 1/03 (2006.01) H05K 1/05 (2006.01) H05K 3/38 (2006.01) H05K 3/46 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01) H05K 3/44 (2006.01)
Patent
CA 1157622
ABSTRACT OF THE DISCLOSURE A blank and method for its manufacture which blank is useful in the preparation of printed circuit boards. The blank comprises an insulating substrate, typically impregnated with an epoxy resin and with reinfo???? fiber glass. Superimposed and adhered to at least one surface of the substrate is a high temperature thermoplastic polymer film or sheet having a substantially uniform thickness between about 10 and about 500 microns. The thermoplastic polymer surface can be chemically treated to activate it and facilitate subsequent deposition of an adherent film of electrolessly deposited metal thereon. The circuits formed by such deposition are uniform, have excellent adherence of a conductor pattern to the thermoplastic polymer surface, have excellent electrical properties and resist heat in continuous use or when soldered.
350711
Frisch David C.
Weber Wilhelm
Kollmorgen Technologies Corporation
Macrae & Co.
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