Porous bottom-layer dielectric composite structure

Details Porous bottom-layer dielectric composite structure Porous bottom-layer dielectric composite structure

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B32B 18/00 (2006.01) C04B 41/52 (2006.01) H01L 21/48 (2006.01) H05K 1/03 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1262576

TITLE PD-2250 POROUS BOTTOM-LAYER DIELECTRIC COMPOSITE STRUCTURE ABSTRACT A method for inhibiting the formation of blisters during the firing of intermediate layers of fired multilayer electronic components comprising the sequential steps of: (1) applying to a substrate a first and second layer of finely divided particles of dielectric solids and glass dispersed in organic medium; and (2) firing the layers to effect volatilization of the organic medium therefrom, liquid phase sintering of the glass components and densification of both layers, the softening point of the glass, the particle size of the glass and the ratio of glass to dielectric solids in both layers being adjusted in such manner that when the layers are fired, the first layer is porous and the second layer is nonporous.

542331

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