Porous encapsulating composition for electrical apparatus

Details Porous encapsulating composition for electrical apparatus Porous encapsulating composition for electrical apparatus

H - Electricity

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H01F 27/22 (2006.01) B29C 67/24 (2006.01) C08K 7/00 (2006.01) C09K 5/00 (2006.01) H01F 27/02 (2006.01) H01F 38/30 (2006.01)

Patent

CA 1107425

47,742 POROUS ENCAPSULATING COMPOSITION FOR ELECTRICAL APPARATUS ABSTRACT OF THE DISCLOSURE A porous encapsulating composition is formed of particulate filler material which is cohesively bonded together by a binder material which forms beads around the points of contact between contiguous particles. In one embodiment, the filler material includes round gravel and resin-coated sand particles with the resin being redistrib- uted to form beads around the points of contact between con- tiuguous particles.

315639

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