Positioned chip surface covering

Details Positioned chip surface covering Positioned chip surface covering

B - Operations, Transporting

05

D

26/184

B05D 5/00 (2006.01) B44C 1/04 (2006.01) B44F 1/08 (2006.01) D06N 7/00 (2006.01)

Patent

CA 1269826

POSITIONED CHIP SURFACE COVERING Abstract The present invention relates to a process for preparing chip-containing decorative surfaces wherein the chips are positioned so as to provide a pattern. A first adhesive material is selectively applied to a support surface and the conditions are adjusted so that the first adhesive material is substantially non-adhesive in nature. A second adhesive material is selectively applied as a pattern on top of or adjacent to the first adhesive material and chips are applied to the surface so as to be adhered by the second adhesive material. Any non-adhered chips are removed and the conditions are adjusted so that the first adhesive material demon- strates adhesive properties. A second type or color of chip material is then applied so as to be adhered by the first adhesive material. Upon removal of the non-adhered chips, a product is obtained having a positioned chip pattern. The process may also be practiced using additional adhesives and chips so as to provide products having more than two types of positioned chips.

483862

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