Positive photoresist composition

G - Physics – 03 – F

Patent

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Details

G03F 7/039 (2006.01) G03F 7/004 (2006.01)

Patent

CA 2112285

ABSTRACT OF THE DISCLOSURE The present invention provides a positive photoresist composition comprising an alkali-soluble resin containing a copolymer of p-vinylphenol or a derivative thereof and styrene, a dissolution inhibitor and a photo-induced acid precursor. This positive photoresist composition exhibits excellent sensitivity and resolution while maintaining excellence in other properties such as heat resistance, film thickness retention, adhesion and profile, in the far ultraviolet ray lithography.

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