Positive photoresist composition

G - Physics – 03 – F

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96/166

G03F 7/022 (2006.01) C08G 8/12 (2006.01) G03F 7/023 (2006.01) G03F 7/038 (2006.01)

Patent

CA 2029464

ABSTRACT OF THE DISCLOSURE A positive photoresist composition consisting essentially of a photosensitive component comprising an ester of 2,3,4,4'- tetrahydroxybenzophenone, having on the average, greater than 3.2 of the hydroxy groups of the 2,3,4,4'-tetrahydroxybenzophenone esterified by 1,2-naphthoquinonediazide-5-sulfonic acid; and a water insoluble, aqueous alkali soluble novolak resin obtained by condensing with formaldehyde a mixture of from about 2.0 to about 5.0 mol percent of 2,4-xylenol, from about 1.5 to about 4.5 mol percent of 2,5-xylenol, from about 1.5 to about 4.0 mol percent of 2,6-xylenol, from about 2.0 to about 5.0 mol percent o- ethylphenol, and the balance m-cresol and p-cresol in a respective mol ratio of from about 0.5 to about 2.0 to 1.

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