Positive photoresist composition

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 14/09 (2006.01) G03F 7/022 (2006.01) G03F 7/023 (2006.01) G03F 7/039 (2006.01)

Patent

CA 2045917

A positive photoresist composition containing (i) a quinone diazide polymer formed by reacting a cresol-formaldehyde novolac resin and an o-quinonediazide compound, and (ii) a sulfonamide devel- opment enhancement agent.

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