C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 14/09 (2006.01) G03F 7/022 (2006.01) G03F 7/023 (2006.01) G03F 7/039 (2006.01)
Patent
CA 2045917
A positive photoresist composition containing (i) a quinone diazide polymer formed by reacting a cresol-formaldehyde novolac resin and an o-quinonediazide compound, and (ii) a sulfonamide devel- opment enhancement agent.
Amstutz Gary A.
Bassett David R.
Ocg Microelectronic Materials Inc.
Sim & Mcburney
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