C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
149/28
C09D 9/00 (2006.01) G03F 7/42 (2006.01)
Patent
CA 1240907
ABSTRACT OF THE DISCLOSURE Piperazine containing positive photoresist stripping compositions are provided. Formulations include N-aminoalkylpiperazines with the formula Image bis-N-aminoalkylpiperazines of the formula Image N-hydroxyalkylpiperazine of the formula Image and bis-hydroxyalkylpiperazines with structure Image In the above formulae n = 1-6. Also included are piperazine derivatives such as those of the above formulae with a branch chain alkyl of 1-6 C atoms, and 5-6 C atom cycloalkyl substituted compounds wherein the cycloalkyl is substituted for -(CH2)n-. Components which may be mixed with the above described piperazine in preparing the positive photoresist stripping compositions of the invention include alkyl or cycloalkyl-2-pyrrolidones of the formula Image Other amide type solvents with the boiling point in excess of 200°C as well as high boiling diethylene glycol ethers may also be incorporated.
469694
Cook Kane D.
Smalley Edmund W.
Thomas Evan G.
General Chemical Corporation
Gowling Lafleur Henderson Llp
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