Positive resist composition

G - Physics – 03 – F

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G03F 7/039 (2006.01) G03F 7/022 (2006.01)

Patent

CA 2076357

- 18 - ABSTRACT OF THE DISCLOSURE A positive resist composition comprising an alkali-soluble resin containing a novolak resin which is obtained by a condensation reaction of a phenol compound and a carbonyl compound and has an area in a GPC pattern of a range in that a molecular weight as converted to polystyrene is not larger than 900 not exceeding 20 % of a whole pattern area excluding the unreacted phenol compound, a quinone- diazide compound and a polyphenol compound of the formula: Image (I) in which R1 and R2 are independently a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group or a group: -OCOR3 in which R3 is an alkyl group or a phenyl group, x and y are independently an integer of 1 to 3, and m is an integer of 0 to 4, wherein a weight ratio of said polyphenol compound (I) to said alkali-soluble resin is from 3:10 to 5:10, which is excellent in heat resistance, sensitivity, resolution and a depth of focus and leaves no scum after development.

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