Positive-type photosensitive electrodeposition coating...

G - Physics – 03 – F

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G03F 7/012 (2006.01) C09D 5/44 (2006.01) G03F 7/022 (2006.01) G03F 7/023 (2006.01)

Patent

CA 2044986

Abstract of the Disclosure A positive-type photosensitive electrodeposi- tion coating composition comprising (A) a photosensitive compound having a molecular weight of not more than 6,000 and containing at least one modified quinonediazidesulfone units represented by the following formula (I) (I) Image wherein R1 represents Image or Image R2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group, R3 represents an alkylene group, a cyclo- alkylene group or an alkylene ether group, and A represents a carboxylic acid ester linkage, in a molecule and; or a photosensitive compound obtained by reacting a polyfunctional amino compound with o- benzoquinonediazidesulfonic acid chloride or o- naphthoquinonediazidesulfonic acid chloride, and (B) a water-soluble or water-dispersible resin having a salt- forming group. Said composition is suitable for forming a printed wiring photoresist by coating an electrically conductive material-clad laminated plate by electrode- position to form a smooth film whose portion exposed to actinic rays such as ultraviolet light through a positive photomask can be washed away with a developing solution.

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