G - Physics – 03 – F
Patent
G - Physics
03
F
G03F 7/004 (2006.01) G03F 7/038 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2427923
A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.
L'invention concerne une composition de résine époxy photosensible de type positif contenant (a) une résine époxy possédant deux ou plus de groupes époxy dans une molécule, (b) une résine phénolique modifiée possédant un anneau triazine, (c) un agent durcisseur basique latent et (d) un générateur acide photosensible et une carte de circuit imprimé de préférence multicouches de mode d'accumulation utilisant ladite composition comme couche d'isolation.
Nojima Yasuharu
Sugano Yasuaki
Fetherstonhaugh & Co.
Huntsman Advanced Materials (switzerland) Gmbh
Vantico Ag
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