Positive-type photosensitive resin compositions

Details Positive-type photosensitive resin compositions Positive-type photosensitive resin compositions

G - Physics

03

F

G03F 7/038 (2006.01) C25D 9/02 (2006.01) G03F 7/022 (2006.01) G03F 7/023 (2006.01) G03F 7/16 (2006.01)

Patent

CA 2114461

- 56 - ABSTRACT OF THE DISCLOSURE A positive-type photosensitive resin composition containing a resin which results from reactions between a specific polyepoxide compound, a carboxylic acid compound having a specific phenolic hydroxyl group, a carboxylic acid compound having no specific phenolic hydroxyl group, and 1, 2 - quinone diazide sulfonyl halide. The resin composition has high exposure sensitivity, is capable of inhibiting swell or dissolution of unexposed areas during the stage of development, and yet retains other favorable properties. The resin composition has also attained short developing time.

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