G - Physics – 03 – F
Patent
G - Physics
03
F
402/2
G03F 7/039 (2006.01)
Patent
CA 1316622
Abstract of the disclosure A positive type photosensitive resinous composition which is specifically useful in a photoresist for printed circuit board, integrated circuit board and the like and in a lithographic plate is provided. The resinous composition is characterized by comprising a resin having in its side chains or at the end portions of main chain at least one iminosulfonate group of the formula: Image in which R1 and R2 each is selected from hydrogen atom, an alkyl, an acyl, a phenyl, a naphthyl, an anthryl and a benzyl group, or R1 and R2 may, taken together, form an alicyclic ring, the iminosulfonate content being 1.5 x 10-4 to 2.5 x 10-3 equivalent/g and the resin being free from glycidyl group or the like which may cause polymerization in the presence of sulfonic acid.
567896
Ishikawa Katsukiyo
Nishijima Kanji
Shirai Masamitsu
Tanaka Makoto
Tsunooka Masahiro
Marks & Clerk
Nippon Paint Co. Ltd.
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