Positive type photosensitive resinous composition

Details Positive type photosensitive resinous composition Positive type photosensitive resinous composition

G - Physics

03

F

96/158

G03F 7/016 (2006.01) C08F 220/02 (2006.01) G03F 7/023 (2006.01) G03F 7/027 (2006.01)

Patent

CA 2024482

Abstract of the disclosure A positive type photosensitive resinous composition comprising a binder resin and a quinone diazide compound, the binder resin being a copolymer of (a) at least one phosphoric acid ester monomer represented by the formula: Image (b) at least one acid group containing .alpha.,.beta.-ethylenically unsaturated monomer, and (c) other copolymerizable .alpha.,.beta.-ethylenically unsaturated monomers than (a) and (b), which is specifically useful for the formation of resist coating in the preparation of printed circuit board.

Affiliated with

Also associated with

Rating

Positive type photosensitive resinous composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Positive type photosensitive resinous composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Positive type photosensitive resinous composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1394288