Positive type photosensitive resinous composition and...

Details Positive type photosensitive resinous composition and... Positive type photosensitive resinous composition and...

G - Physics

03

C

96/165

G03C 1/72 (2006.01) C08G 59/14 (2006.01) C08G 59/42 (2006.01) C08G 59/62 (2006.01) G03F 7/022 (2006.01) G03F 7/023 (2006.01)

Patent

CA 1330405

Abstract The invention provides a positive type photosensitive resinous composition comprising a resin obtained by the reaction of a polyepoxide compound, an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) and 1,2-quinondiazido sulfonic acid halide with the use of those three components in a defined proportion, which is useful for microfabrication photo-resist and photosensitive materials for use in lithographic plates because of excellent flexibility and adhesion to supporting substrates, when developed, non-exposed area are extremely resistive toward swelling.

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