Positive working photodefinable resin coated metal for mass...

Details Positive working photodefinable resin coated metal for mass... Positive working photodefinable resin coated metal for mass...

H - Electricity

05

K

H05K 3/46 (2006.01)

Patent

CA 2296112

High density built-up multilayer printed circuit boards are produced by constructing microvias with positive working photoimageable dielectric materials. A positive working photosensitive dielectric composition (4) on a conductive foil (2) is laminated to conductive lines (6) on a substrate (8). After imaging the foil (2), and imaging and curing the photosensitive dielectric composition (4), vias (14) are formed to the conductive lines (6). Thereafter the conductive lines (6) are connected (16) through the vias (14) to the conductive foil (2), and then the conductive foil (2) is patterned.

On produit des tableaux de connexions multicouche imprimés composites et de densité élevée par mise en place de trous d'interconnexion au moyen de matériaux diélectriques positifs photo-imageables. On pellicule des tracés électro-conducteurs (6) se trouvant sur un substrat (8) au moyen d'une composition diélectrique positive photosensible (4) sur film électro-conducteur (2). Après formation d'image sur le film électro-conducteur (2), formation d'image et prise de la composition diélectrique photosensible (4), on ménage des trous d'interconnexion (14) aboutissant aux tracés électro-conducteurs (6). Ces tracés électro-conducteurs (6) sont, par la suite, connectés (16) au moyen des trous d'interconnexion (14) au film électro-conducteur (2) qui se trouve alors configuré.

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